Method of aluminizing metal alloys by weld overlay using...

Metal treatment – Process of modifying or maintaining internal physical... – Processes of coating utilizing a reactive composition which...

Reexamination Certificate

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Details

C148S281000, C148S525000, C148S535000, C219S076100, C428S457000

Reexamination Certificate

active

06284058

ABSTRACT:

BACKGROUND OF THE INVENTION
This invention relates generally to the art of coating and more particularly to a new process for coating metals with an environmental resistent coating.
Aluminizing is the process of forming an aluminum or aluminum alloy coating on a metal either by dipping in a bath of molten aluminum (hot dipping); coating by a thermal spray process (hot spraying); or, by immersing in a mixture of aluminum powder combined with other chemicals (pack cementation). Aluminizing is used to improve the environmental resistance of a wide variety of alloys. The increase in surface concentration of aluminum or the formation of aluminide coatings often provides superior resistance to oxidizing, sulfidizing, or carburizing conditions. A drawback of hot dipping and pack cementation is that the parts being aluminized must be of a size and shape that is conducive to immersion in a containment vessel. A drawback of thermal spraying is that only a thin layer of alloy reacts with aluminum during the process to form an aluminum alloy or aluminide.
Clear need exists to be able to provide a better aluminizing process.
SUMMARY OF THE INVENTION
It is thus an object of this invention to provide a novel process for aluminizing metal or alloy.
It is a further object of this invention to provide such an aluminizing process which provides considerably thicker coatings than have heretofore been available.
These as well as other objects are accomplished by welding an aluminum layer onto a metal substrate to provide a thick aluminized layer on the surface thereof.


REFERENCES:
patent: 3857165 (1974-12-01), Vernam et al.
patent: 5321224 (1994-06-01), Kamimura et al.
patent: 5900170 (1999-05-01), Marcin, Jr. et al.

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