Method of aligning wafer using database constructed of...

Photocopying – Projection printing and copying cameras – Focus or magnification control

Reexamination Certificate

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C355S052000

Reexamination Certificate

active

07342643

ABSTRACT:
The aligning of a wafer with a reticle in photolithographic equipment is carried out using a feed forward method. In the method, a wafer is loaded onto an exposure apparatus, the wafer is aligned with a reticle, the state of alignment is measured, alignment data representative of the state of alignment is produced, and a database is searched for an alignment data type under which the alignment data falls. The database may also be searched for overlay data related to the alignment data. A correction value matched to the alignment data type is obtained. The correction value maybe calculated from the overlay data. The alignment of the wafer is corrected by applying the correction value to the alignment data. Finally, the aligned wafer is exposed.

REFERENCES:
patent: 6686107 (2004-02-01), Matsumoto et al.
patent: 2005/0137837 (2005-06-01), Oishi et al.
patent: 07-302754 (1995-11-01), None
patent: 1020030009001 (2003-01-01), None
patent: 1020030045316 (2003-06-01), None

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