Method of aligning a mask and a wafer for manufacturing semicond

Details Method of aligning a mask and a wafer for manufacturing semicond Method of aligning a mask and a wafer for manufacturing semicond

1983-08-08

1985-07-23

Rosenberger, R. A.

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

356400, G01N 2130

Patent

active

045306044

ABSTRACT:
This specification discloses a method of aligning a mask and a wafer for manufacturing semiconductor circuit elements into a predetermined positional relationship. The method comprises two steps. In a first step, the mask and wafer are aligned by the use of relatively large alignment marks provided on the mask and wafer. In a second step, the mask and wafer are aligned by using relatively small key patterns provided on the mask and wafer and having substantially no positional deviation with respect to actual element (circuit) patterns.

REFERENCES:
patent: 3796497 (1974-03-01), Mathisen et al.
patent: 3865254 (1975-02-01), Johannsmeier
patent: 4070117 (1978-01-01), Johannsmeier et al.
patent: 4127777 (1978-11-01), Binder
patent: 4167677 (1979-09-01), Suzki

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