Method of adhesion and adhesion apparatus

Details Method of adhesion and adhesion apparatus Method of adhesion and adhesion apparatus

2006-02-14

2006-02-14

Haran, John T. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S285000, C427S561000, C427S208200

Reexamination Certificate

active

06998000

ABSTRACT:
A method of adhesion inhibiting generation of bubbles is provided. Heating, evacuation and centrifugal degassing are performed on an adhesive37disposed in an adhesive container30to semi-harden the adhesive37, then a semi-hardened adhesive is discharged as disposed in the adhesive container30to mount a chip. Removal of bubbles is efficiently performed since semi-hardening and degassing are simultaneously performed. Further, no defective product is produced even if a working process is stopped since no process for semi-hardening a discharged adhesive exists.

REFERENCES:
patent: 4778845 (1988-10-01), Tschan et al.
patent: 5926694 (1999-07-01), Chigawa et al.
patent: 6077382 (2000-06-01), Watanabe
patent: 6235554 (2001-05-01), Akram et al.

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