Method of adhering green tape to a metal support substrate with

Metal working – Method of mechanical manufacture – Electrical device making

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29831, 156 89, 156320, 428209, 428210, H01K 322

Patent

active

055818765

ABSTRACT:
In the manufacture of ceramic circuit boards having ceramic or metal support substrates, a bonding glass layer that is adherent both to the substrate material and to multilayer green tape compositions having circuitry printed thereon, is deposited and flowed onto the support substrate. The bonding glasses suitable for use with nickel plated metal substrates and green tape compositions containing forsterite-cordierite-type glasses are mixed oxides including calcium, zinc and boron as well as other oxides. These bonding glasses have a thermal coefficient of expansion that is larger than said metal substrate, and a flow temperature below that of said cordierite-type glasses.

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