Method of adherency of electrodeposits on light weight metals

Details Method of adherency of electrodeposits on light weight metals Method of adherency of electrodeposits on light weight metals

1977-06-03

1979-06-12

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

204 40, 204 41, 204 44, 428652, C25D 544

Patent

active

041579410

ABSTRACT:
A plated aluminum product, and the method of making such product is disclosed for use in automotive bumpers. A plated outer decorative coating is used and is preferably constituted of chromium (0.000005-0.00005" thick) on nickel (0.0003-0.003" thick.) An electroplated pretreatment system is employed between the outer decorative coating and aluminum alloy and consists essentially of at least a brass strike containing, for purposes of increased lateral corrosion resistance, an as-deposited copper content in the range of 60-75% by weight, and the aluminum substrate should preferably be restricted to a zinc content of 4.5-5.5%.
The pretreatment system may be expanded to include a copper layer encased in two layers of brass, a first layer most adjacent the aluminum substrate containing said 60-75% copper and a second brass layer most adjacent the decorative coating containing 50-60% copper. The plating solution for carrying out the brass plating is constituted to provide enhanced covering and throwing power, and specifically may contain 3.6-9.6 oz./gal. sodium cyanide, the ratio of sodium cyanide to metal should be 0.12-1.6 times the metal, 2-5 oz./gal. sodium hydroxide 4-12 oz./gal. divided to contain 68-85% copper and 15-32% zinc.

REFERENCES:
patent: 1947981 (1934-02-01), Fischer
patent: 2702785 (1955-02-01), Eyerund
patent: 3468765 (1939-09-01), McConnell
patent: 3909209 (1975-09-01), Kruper et al.
patent: 3930965 (1976-01-01), Abbott

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