Method of adding mass to MEMS structures

Details Method of adding mass to MEMS structures Method of adding mass to MEMS structures

2006-02-28

2006-02-28

Stein, Stephen (Department: 1775)

Stock material or miscellaneous articles

Composite

Of silicon containing

C428S446000, C073S514010, C073S514360, C073S514380, C216S002000, C216S099000

Reexamination Certificate

active

07005193

ABSTRACT:
A proof mass (11) for a MEMS device is provided herein. The proof mass comprises a base (13) comprising a semiconductor material, and at least one appendage (15) adjoined to said base by way of a stem (21). The appendage (15) comprises a metal (17) or other such material that may be disposed on a semiconductor material (19). The metal increases the total mass of the proof mass (11) as compared to a proof mass of similar dimensions made solely from semiconductor materials, without increasing the size of the proof mass. At the same time, the attachment of the appendage (15) by way of a stem (21) prevents stresses arising from CTE differentials in the appendage from being transmitted to the base, where they could contribute to temperature errors.

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Liang-Yu Chen, “Process Development for the Integration of MEMS and RF Devices”,Cornell Nanofabrication Facility, National Nanofabrication Users Network, pp. 20-21 (1999).

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