Method of adding fine line conductive/resistive patterns to a th

Details Method of adding fine line conductive/resistive patterns to a th Method of adding fine line conductive/resistive patterns to a th

1982-08-19

1985-04-02

Bueker, Richard

Coating processes

Electrical product produced

Welding electrode

427 96, 427264, 427265, 427266, 427275, 427292, 4273763, 4273835, B05D 512

Patent

active

045087547

ABSTRACT:
A method of adding fine line circuits to a thick film microcircuit comprising the steps of: cutting a circuit pattern on a substrate; filling the circuit pattern with a conductive or resistive paste and removing the excess; adding screen printing thick film circuit elements on the substrate surface and over selected portions of the fine line pattern; and heating thereby sintering the paste and thick film elements to the substrate.

REFERENCES:
patent: 3240624 (1966-03-01), Beck
patent: 3392052 (1968-07-01), Davis
patent: 3669733 (1972-06-01), Allington
patent: 4020206 (1977-04-01), Beil
patent: 4081653 (1978-07-01), Koo et al.
patent: 4119480 (1978-10-01), Nishi et al.
patent: 4191789 (1980-05-01), Brown
patent: 4270823 (1981-06-01), Kuznetzoff
patent: 4336320 (1982-06-01), Cummings et al.

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