Method of achieving selective inhibition and control of adhesion

Electricity: electrical systems and devices – Miscellaneous

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361411, 361406, 501 32, 427 96, 174260, H05K 102

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active

051229293

ABSTRACT:
A technique for providing controlled adhesion of a portion of a printed conductor to a circuit board employs an inhibitor layer between the circuit board and the portion of the printed conductor where such controlled adhesion is desired. The inhibitor layer is formed using a mixture of finely divided alumina powder and a glass frit, which are both suspended in an organic screening agent. An electrical module connected between controllably adherent conductor portions is thereby able to move to relative mechanical stresses.

REFERENCES:
patent: 4517155 (1985-05-01), Prakash et al.
patent: 4728751 (1988-03-01), Canestaro et al.
patent: 4733018 (1988-03-01), Prabhu et al.
patent: 4816615 (1989-03-01), Prabhu et al.
patent: 4830878 (1989-05-01), Kaneko et al.
patent: 4940849 (1990-07-01), Morris et al.
European Search Report on European Patent Application EP 89 30 6821 dated 7 Jun. 1991.
Annex to the European Search Report on European Patent Application No. EP 89 30 6821 dated Jun. 7, 1991.

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