Method of accommodating in volume expansion during solder...

Details Method of accommodating in volume expansion during solder... Method of accommodating in volume expansion during solder...

2006-08-08

2006-08-08

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S843000, C029S855000, C228S179100, C228S180220, C257S778000

Reexamination Certificate

active

07086147

ABSTRACT:
Solder balls such as, low melt C4 solder balls, undergo volume expansion during reflow, such as may occur during attachment of chip modules to a PCB. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodated this volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.

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