Method of accessing the circuitry on a semiconductor substrate f

Details Method of accessing the circuitry on a semiconductor substrate f Method of accessing the circuitry on a semiconductor substrate f

1999-06-02

2000-09-19

Powell, William

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

438 8, 438707, H05K 114

Patent

active

061221740

ABSTRACT:
An apparatus is disclosed. In one embodiment, the apparatus includes a semiconductor substrate and a second substrate. The semiconductor substrate has a top side and a bottom side. The semiconductor substrate has an integrated circuit and at least one alignment fiducial formed on the top side. The alignment fudicial is aligned with the integrated circuit and the alignment fiducial is accessible from the bottom side. The semiconductor substrate further includes a first set of bond pads on the integrated circuit, the bond pads on the top side. The second substrate has a second set of bond pads corresponding to the first set of bond pads. The semiconductor substrate is coupled to the second substrate at a plurality of solder interconnections disposed between the first and the second set of bond pads.

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patent: 4732646 (1988-03-01), Elsner et al.
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patent: 5246539 (1993-09-01), Canestrari et al.
patent: 5268065 (1993-12-01), Grupen-Shemansky
patent: 5805421 (1998-09-01), Livengood et al.

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