Method of ablating an opening in a hard, non-metallic substrate

Details Method of ablating an opening in a hard, non-metallic substrate Method of ablating an opening in a hard, non-metallic substrate

2005-03-08

2005-03-08

Elve, M. Alexandra (Department: 1725)

Electric heating

Metal heating

By arc

C219S121700

Reexamination Certificate

active

06864460

ABSTRACT:
A method of ablating a hole into a hard, non-metallic substrate is disclosed. At least on laser assembly capable of generating a laser beam in an axis having a focus that is moveable relative to said axis is provided. A focus of the laser beam is positioned adjacent at least one surface of the substrate. A first layer of the substrate is ablated by the laser beam. The focus is moved relative to the axis corresponding to the depth of the substrate thereby enabling ablation of successive layers of the substrate. Successive layers of the substrate are ablated to generate a hole into the substrate.

REFERENCES:
patent: 3410979 (1968-11-01), Larsson
patent: 3527198 (1970-09-01), Takaoka
patent: 3601457 (1971-08-01), Helms
patent: 3696504 (1972-10-01), Cupler, II
patent: 3742182 (1973-06-01), Saunders
patent: 3770936 (1973-11-01), Rively et al.
patent: 3885943 (1975-05-01), Chui
patent: 3930825 (1976-01-01), Chui
patent: 3971910 (1976-07-01), Marschalko et al.
patent: 4323755 (1982-04-01), Nierenberg
patent: 4441008 (1984-04-01), Chan
patent: 4544442 (1985-10-01), Lassen
patent: 4789770 (1988-12-01), Kasner et al.
patent: 4839497 (1989-06-01), Sankar et al.
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 4912298 (1990-03-01), Daniels et al.
patent: 5063280 (1991-11-01), Inagawa et al.
patent: 5310120 (1994-05-01), Ehinger et al.
patent: 5317661 (1994-05-01), Szentesi et al.
patent: 5379016 (1995-01-01), Smith et al.
patent: 5401973 (1995-03-01), McKeown et al.
patent: 5434420 (1995-07-01), McKeown et al.
patent: 5451794 (1995-09-01), McKeown et al.
patent: 5489321 (1996-02-01), Tracy et al.
patent: 5578229 (1996-11-01), Barnekov et al.
patent: 5629570 (1997-05-01), Weigert
patent: 5665134 (1997-09-01), Kirby et al.
patent: 5757016 (1998-05-01), Dunn et al.
patent: 5894538 (1999-04-01), Presby
patent: 5902368 (1999-05-01), Witzmann et al.
patent: 5966485 (1999-10-01), Luther et al.
patent: 5978189 (1999-11-01), Habu
patent: 5984159 (1999-11-01), Ostendarp et al.
patent: 6112967 (2000-09-01), Ostendarp et al.
patent: 6204472 (2001-03-01), Muzzi et al.
patent: 6211488 (2001-04-01), Hoekstra et al.
patent: 6289600 (2001-09-01), Watts

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