Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1982-04-26
1984-07-03
Smith, John D.
Compositions
Electrically conductive or emissive compositions
Free metal containing
523200, 524876, 427 96, 106 118, H05K 312
Patent
active
044578610
ABSTRACT:
Printed circuits are produced by an additive technique wherein a metal-loaded resinous ink is first printed on the board, the circuit next being covered with a conductive metal powder while the ink is still wet. The powder is then pressed into the ink and the circuit cured. Next, a solder stratum is alloyed with the powder as by a solder paste printed over the circuit and the board heated to cause the solder to alloy with the ink and powder substrates. A solder resist may then be applied selectively over the circuit and multiple layers of circuits may be built up on the board. The conductive ink is an epoxy resin loaded with a metallic powder, preferably copper, with a catalyst added to the ink. The solder paste is a lead-tin alloy containing antimony suspended in a binder and a flux.
The apparatus employed to carry out the procedure includes silk screens and a roller arrangement for pressing the metallic powder into the ink. The press includes a plurality of progressively harder rollers. The process may be used to manufacture original circuits, or to repair or make changes to conventional printed circuits.
REFERENCES:
patent: 3391455 (1968-07-01), Hirohata et al.
patent: 3910852 (1975-10-01), Lederman et al.
patent: 4073999 (1978-02-01), Bryan et al.
Kirk-Othmer Encyclopedia of Chemical Technology, vol. 15, p. 176, 2nd edition, .COPYRGT.1968, John Wiley & Sons, Inc.
Additive Technology Corporation
Smith John D.
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