Method manufacturing wiring substrate

Details Method manufacturing wiring substrate Method manufacturing wiring substrate

2008-01-04

2010-02-23

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C174S262000, C257S508000

Reexamination Certificate

active

07665209

ABSTRACT:
There is provided a wiring substrate for connecting a mounting board on one surface thereof and mounting an integrated circuit chip on the opposite surface to the surface. The wiring substrate has a conductive connecting portion penetrating the substrate for connecting to at least a portion of a wiring layer of the integrated circuit chip, with the portion of a wiring layer formed on the substrate, and an insulating portion formed at a lateral side of the connecting portion for surrounding the connecting portion via a portion of the wiring substrate.

REFERENCES:
patent: 5477933 (1995-12-01), Nguyen
patent: 6606237 (2003-08-01), Naito et al.
patent: 6750516 (2004-06-01), Hartwell
patent: 6764931 (2004-07-01), Iijima et al.
patent: 2004/0119130 (2004-06-01), Peichi et al.
patent: 2001-102479 (2001-04-01), None
patent: 2005-086036 (2005-03-01), None
Japanese Office Action issued on Dec. 18, 2007 corresponding to JP 2004-049132.

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