Superconductor technology: apparatus – material – process – Processes of producing or treating high temperature... – Coating
Patent
1997-02-14
1999-06-01
King, Roy V.
Superconductor technology: apparatus, material, process
Processes of producing or treating high temperature...
Coating
505480, 505500, 505501, 505220, 505230, 427 62, H01L 3924
Patent
active
059088133
ABSTRACT:
The present invention discloses an integrated circuit that is wired with a high-temperature superconductive material that is superconductive at temperatures of about 70.degree. K and above, and methods of making the integrated circuit. The front-end manufactured semiconductor structure is patterned with a preferred precursor metal or metal oxide and a complementary compound is superposed and reacted to form wiring lines of superconductor ceramics that complete integrated circuits within the front-end manufactured semiconductor structure. The front-end manufactured semiconductor structure is alternatively patterned first with the complementary compound and the precursor metal is thinly patterned by ion implantation. The front-end manufactured semiconductor structure is then treated to form wiring lines of superconductor ceramics that complete integrated circuits within structure. The conductive lines, if formed within an oxidized portion of the complementary compound, are self-insulating by the presence of the oxided complementary compound. Operation of the devices is accomplished at "high" superconductive temperatures that cause improved solid state operation of the device, minimizing molecular vibrations and dislocation effects, and cause the wiring to be superconductive.
REFERENCES:
patent: 4965248 (1990-10-01), Poppe et al.
patent: 5010053 (1991-04-01), Maroni
patent: 5079223 (1992-01-01), Maroni
patent: 5141917 (1992-08-01), Tanaka et al.
patent: 5196379 (1993-03-01), Weaver et al.
patent: 5200389 (1993-04-01), Tachikawa et al.
patent: 5206213 (1993-04-01), Cuomo et al.
Nastasi et al, Appl. Phys. Lett. 52(20) May 1988, pp. 1729-1731.
Hubbard et al, J. Appl. Phys. 69(4) Feb. 1991, pp. 2397-2404.
Severin et al, Mat. Res. Bull., vol. 23, pp. 707-717, 1988.
King Roy V.
Micro)n Technology, Inc.
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