Method for wire-bonding a covered wire

Details Method for wire-bonding a covered wire Method for wire-bonding a covered wire

1996-12-05

1999-04-27

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

219 5622, H01L 2160

Patent

active

058970495

ABSTRACT:
To assure the continuity of bonding by preventing any buckling of a covered wire or slipping-off of the covered wire from a second clamper, the second clamper is caused to vibrate while a capillary and first clamper are being raised to a ball formation level after the first clamper is closed and the second clamper is opened in the step of raising the capillary and first clamper to the ball formation level, thus preventing the covered wire from sticking to the second clamper.

REFERENCES:
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 5370300 (1994-12-01), Okumura

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