Optics: measuring and testing – Material strain analysis – By light interference detector
Reexamination Certificate
2006-05-09
2008-07-22
Connolly, Patrick J (Department: 2877)
Optics: measuring and testing
Material strain analysis
By light interference detector
C356S512000, C073S800000
Reexamination Certificate
active
07403270
ABSTRACT:
A novel method for whole field thin film stress evaluation is provided. Through the provided method, the whole filed thin film stress distribution for an optical thin film would be developed with a commercial interferometer, so that a whole field evaluation for the crack or peel-off of thin film is hence achievable.
REFERENCES:
patent: 6466308 (2002-10-01), Jaing et al.
patent: 7261985 (2007-08-01), Smith et al.
patent: 2005/0202328 (2005-09-01), Smith et al.
Chen Chien-Jen
Huang Chi Hung
Shih Mao-Yuan
You Hsien-I
Connolly Patrick J
Instrument Technology Research Center, National Applied Laborato
Volpe and Koenig PC
LandOfFree
Method for whole field thin film stress evaluation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for whole field thin film stress evaluation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for whole field thin film stress evaluation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3969525