Method for wet processing of a semiconductor substrate

Details Method for wet processing of a semiconductor substrate Method for wet processing of a semiconductor substrate

1995-03-23

1997-10-14

Niebling, John

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

B08B 700

Patent

active

056767609

ABSTRACT:
Electrolyzed waters, including an anode water and a cathode water, having either oxidizing or reducing activity and having either acidity or alkalescency, which is obtained by electrolysis of an aqueous solution prepared by addition of a minute amount of electrolytes, is applied wet processings including cleaning, etching and rinsing processings of semiconductor wafers. The effects of the electrolyzed waters are not lower than those the conventional acidic or alkalic chemicals provide, and remarkably reduces quantity of chemicals used in wet processings in semiconductor manufacturing.

REFERENCES:
patent: 3959098 (1976-05-01), Schwartz
patent: 5097130 (1992-03-01), Koashi
patent: 5290361 (1994-03-01), Hayashida
patent: 5409569 (1995-04-01), Seki
"A Cleaning Method Utilizing Red/Ox Procedures--A New Cleaning Method in Electronics Industry" The Journal for Cleaning Design by Sumita et al., spring issue of 1987, no month available.
"A New Science of Water and Application Technologies", by Sumita, pp. 190-207 (Aug. 1992).

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