Method for wedge bonding using a gold alloy wire

Details Method for wedge bonding using a gold alloy wire Method for wedge bonding using a gold alloy wire

1997-07-28

1999-08-31

Yee, Deborah

Alloys or metallic compositions

Gold base

420508, 420509, 420510, 438617, 2282622, 228904, C22C 502

Patent

active

059450657

ABSTRACT:
A gold alloy wire for wedge bonding, comprising 1 to 100 parts per million by weight of calcium (Ca), the remainder being gold and inevitable impurities, said gold alloy wire having a tensile strength of not less than 33.0 kg/mm.sup.2 and an elongation of 1 to 3%. The gold alloy wire has a gold purity of not less than 99.9% or further comprises 0.2 to 5.0% by weight of at least one element selected from the group consisting of Pd, Ag and Pt.

REFERENCES:
patent: 5263246 (1993-11-01), Aoki
patent: 5658664 (1997-08-01), Uno et al.
Japanese Patent Abstract No. JP61189652, Publication Date 1986, p. 1/1.
Japanese Patent Abstract No. JP01078698, Publication Date 1989, p. 1/1.
Japanese Patent Abstract No. JP02219250, Publication Date 1990, p. 1/1.
Japanese Patent Abstract No. JP05009624, Publication Date 1993, p. 1/1.

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