Method for wave soldering with lead-free solder materials

Details Method for wave soldering with lead-free solder materials Method for wave soldering with lead-free solder materials

1995-05-10

1997-08-19

Bradley, P. Austin

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228206, 228260, H05K 334, B23K 3538

Patent

active

056579241

ABSTRACT:
A method is available for wave-soldering component groups, especially printed circuit boards with shielding from the environment, in which lead-free or at least low-lead solders, especially tin solders, with a melting point of more than 210.degree. C., are used. Since in wave soldering the solder bath temperature must usually be set considerably higher than the melting point of the solder, problems with overheating the components are encountered with higher-melting lead-free or low-lead solders. This problem is solved in accordance with the invention by setting a solder bath temperature which is only a few degrees Celsius above the melting point of the solder material, and performing the wave-soldering by the action of a plasma of a process gas atmosphere at low pressure.

REFERENCES:
patent: 5192582 (1993-03-01), Liedke et al.
patent: 5259546 (1993-11-01), Volk
Abstract of Published German Patent Application No. DE 4,225,378 (Sep. 1993).
Peter Fodor, Benefits of Gas Cover Soldering, OCS-SMT Automation, Inc., Montreal, Canada, Nov. 30, 1989.

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