Method for wafer stacking using copper structures of...

Details Method for wafer stacking using copper structures of... Method for wafer stacking using copper structures of...

2007-09-11

2007-09-11

Lee, Calvin (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S782000

Reexamination Certificate

active

11359002

ABSTRACT:
A method for wafer stacking employing substantially uniform copper structures is described herein.

REFERENCES:
patent: 6106735 (2000-08-01), Kurle et al.
patent: 6558109 (2003-05-01), Gibbel
patent: 6627985 (2003-09-01), Huppenthal et al.
patent: 2004/0262772 (2004-12-01), Ramanathan et al.
patent: 2005/0003650 (2005-01-01), Ramanathan et al.

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