Method for wafer scale molding of protective caps

Details Method for wafer scale molding of protective caps Method for wafer scale molding of protective caps

2004-07-26

2009-11-17

Johnson, Christina (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

C264S001100, C264S284000, C264S107000, C264S001320, C264S002500, C264S002700, C264S645000, C264S134000, C264S135000, C264S319000, C264S157000, C264S160000, C264S163000, C264S297800, C257S702000, C257S704000, C257S707000, C257S730000

Reexamination Certificate

active

07618575

ABSTRACT:
A method of molding provides two molds (102, 104) formed of semiconductor material. The molds (102, 104) have substantially planar working faces (108, 110) into which recesses (106, 112) are formed. In use the molds (102, 104) are pressed together with the working faces (108, 110) opposed so the recesses (106, 112) form mold cavities. The molds (102, 104) only contact each other in the plane of the working faces (108, 110). A thermoplastic sheet placed between the molds is heated to deform the sheet into the mold cavities.

REFERENCES:
patent: 3636147 (1972-01-01), Rowland
patent: 4372694 (1983-02-01), Bovio et al.
patent: 4436439 (1984-03-01), Koto
patent: 5118271 (1992-06-01), Baird et al.
patent: 5501784 (1996-03-01), Lessmollmann et al.
patent: 5559932 (1996-09-01), Machida et al.
patent: 5668033 (1997-09-01), O'Hara et al.
patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 5915168 (1999-06-01), Salatino et al.
patent: 6158907 (2000-12-01), Silverbrook et al.
patent: 6585939 (2003-07-01), Dapprich
patent: 6766998 (2004-07-01), Silverbrook
patent: 6949217 (2005-09-01), Silverbrook
patent: 2002/0098672 (2002-07-01), Houston
patent: 05-220751 (1993-08-01), None
patent: 6263164 (1994-09-01), None
patent: 06-347475 (1994-12-01), None
patent: 07-323428 (1995-12-01), None
patent: 09-027466 (1997-01-01), None
patent: 11138911 (1999-05-01), None
patent: 2000-090487 (2000-03-01), None
patent: 2000-340526 (2000-12-01), None
patent: 2002-368028 (2002-12-01), None
patent: WO 85/05496 (1985-12-01), None

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