Method for wafer level stack die placement

Details Method for wafer level stack die placement Method for wafer level stack die placement

2005-11-02

2008-08-26

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE21517, C257SE21599

Reexamination Certificate

active

07416919

ABSTRACT:
A method for wafer level stack die placement is disclosed. At first, a wafer including a plurality of dice is provided. The wafer is adhered to a photosensitive adhesive tape. The wafer is attached on a die carrier to fix at least one die from the wafer on the die carrier. The die carrier may be another wafer. The photosensitive adhesive tape is selectively exposed to form an adhesion-released portion. The adhesion-released portion is aligned with the fixed die. Then, the photosensitive adhesive tape and the die carrier with the fixed die are apart. Therefore the stack die placement in the die-attaching batch is quick and efficient.

REFERENCES:
patent: 6258626 (2001-07-01), Wang et al.
patent: 444364 (2001-07-01), None

Affiliated with

Also associated with

Rating

Method for wafer level stack die placement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for wafer level stack die placement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for wafer level stack die placement will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4008544