Method for wafer analysis with artificial neural network and...

Data processing: artificial intelligence – Neural network – Learning task

Reexamination Certificate

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Details

C700S121000, C702S097000, C702S099000, C438S005000

Reexamination Certificate

active

08010468

ABSTRACT:
A method for wafer analysis with artificial neural network and the system thereof are disclosed. The method of the system of the present invention has several steps, including: first of all, providing a test unit for wafer test and generating a plurality of test data; next, transmitting the test data to a processing unit for transferring to output data; then, comparing the output data with predictive value and modifying bias and making the output data close to the predictive value, and repeating the steps mentioned above to train this system; finally, analyzing wafers by the trained system. Using this system to analyze wafers not only saves time, but also reduces manpower and the risk resulting from artificial analysis.

REFERENCES:
patent: 2003/0229410 (2003-12-01), Smith et al.
patent: 2008/0183412 (2008-07-01), Funk et al.

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