Method for visual inspection of multilayer printed circuit board

Optics: measuring and testing – Inspection of flaws or impurities – Transparent or translucent material

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356 51, 361411, G01N 2188

Patent

active

046979239

ABSTRACT:
A method is disclosed for the visual inspection of electrical circuitry deposited in the layers of a multilayer printed circuit board wherein the dielectric layers of the multilayer board are prepared using a clear, light transparent thermosetting resin having incorporated therein a dye which is permeable to visible light but which absorbs light in the 320-440 nm region.
The electrical circuitry in the board can be easily traced by an observer upon illumination of the board by visible light.

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patent: 4549206 (1985-10-01), Suzuki et al.
West et al., "Computer-Controlled Optical Testing of High Density Printed Circuit Boards" 1983, IBM J. Res. Develop. vol. 27, No. 1, pp. 50-58.

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