Method for vapor phase soldering

Metal fusion bonding – Process – Plural heat applying

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Details

228240, 2281801, 2281802, 228200, B23K 3102

Patent

active

048403059

ABSTRACT:
A method for vapor phase soldering components onto a PWB onto which solder has been previously deposited includes the steps of applying a fluxing agent on the PWB and introducing the PWB into a vapor phase environment. The application of flux is a multi-step process which includes a sequential application of flux to the PWB. The vapor phase environment defines a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The PWB is heated according to a controlled process in which the temperature of the PWB is continuously monitored.

REFERENCES:
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patent: 4077467 (1978-03-01), Spigarelli
patent: 4127692 (1978-11-01), Boynton
patent: 4180199 (1979-12-01), O'Rourke et al.
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patent: 4654502 (1987-03-01), Furtek
"Phase-Four" Production Systems for Vapor Phase Soldering--HTC, Pond Lane, Concord, MA 01742--1983/Pub. 37832.

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