Method for using ultrasonic treatment in combination with UV-las

Details Method for using ultrasonic treatment in combination with UV-las Method for using ultrasonic treatment in combination with UV-las

1996-11-08

1999-10-12

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

134 1, B23K 2600

Patent

active

059650435

ABSTRACT:
A method of forming a via in a laminated substrate by forming ablated material by laser drilling a via in a laminated substrate. The ablated material is deposited on a sidewall of the via. An ultrasonic treatment is applied to the drilled substrate thereby removing ablated material redeposited on sidewalls of the via.

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