Method for use of preflux, printed wiring board, and method for

Stock material or miscellaneous articles – Composite – Of metal

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Details

428209, 428458, 428901, 361748, 427 96, B32B 900

Patent

active

054418143

ABSTRACT:
A printed wiring board comprising a preflux film of a benzimidazole copper complex, wherein the benzimidazole copper complex is formed by (i) applying a preflux to the printed wiring board and (ii) performing an oxidizing treatment of the preflux coated wiring board sufficient to form a benzimidazole copper complex wherein said complex is substantially free of free imidazole groups from the benzimidazole preflux.

REFERENCES:
patent: 3933531 (1976-01-01), Sawa et al.
patent: 4395294 (1983-07-01), Hobbins et al.
patent: 4438190 (1984-03-01), Ishimaru et al.
patent: 4713137 (1987-12-01), Sexton
patent: 4731128 (1988-03-01), Casullo
patent: 5270117 (1993-12-01), Costello et al.
patent: 5275694 (1994-01-01), Yamaguchi et al.

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