Method for use of preflux, printed wiring board, and method for

Details Method for use of preflux, printed wiring board, and method for Method for use of preflux, printed wiring board, and method for

1993-11-12

1995-08-15

Ryan, Patrick J.

Stock material or miscellaneous articles

Composite

Of metal

428209, 428458, 428901, 361748, 427 96, B32B 900

Patent

active

054418143

ABSTRACT:
A printed wiring board comprising a preflux film of a benzimidazole copper complex, wherein the benzimidazole copper complex is formed by (i) applying a preflux to the printed wiring board and (ii) performing an oxidizing treatment of the preflux coated wiring board sufficient to form a benzimidazole copper complex wherein said complex is substantially free of free imidazole groups from the benzimidazole preflux.

REFERENCES:
patent: 3933531 (1976-01-01), Sawa et al.
patent: 4395294 (1983-07-01), Hobbins et al.
patent: 4438190 (1984-03-01), Ishimaru et al.
patent: 4713137 (1987-12-01), Sexton
patent: 4731128 (1988-03-01), Casullo
patent: 5270117 (1993-12-01), Costello et al.
patent: 5275694 (1994-01-01), Yamaguchi et al.

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