Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent
1992-05-08
1995-12-26
Beck, Shrive
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
427553, 427558, 427340, B05D 306
Patent
active
054786070
ABSTRACT:
A method for the production of a printed wiring board according to this invention includes applying a preflux represented by the following general formula (1): ##STR1## (wherein R.sub.1 stands of H or an alkyl group of one to 17 carbon atoms, R.sub.2 for H or an alkyl group of one to six carbon atoms, and n for an integer in the range between 0 and 3) or the following general formula (2): ##STR2## (wherein R.sub.3 stands for H or an alkyl group of one to six carbon atoms, R.sub.4 for H or an alkyl group of one to six carbon atoms, R.sub.5 for an alkyl group of zero to seven carbon atoms, and n for an integer in the range between 0 and 3) to a printed wiring board on which circuits have been formed and then performing an oxidizing treatment on the printed wiring board.
REFERENCES:
patent: 3933531 (1976-01-01), Sawa et al.
patent: 4395294 (1983-07-01), Hobbins et al.
patent: 4731128 (1988-03-01), Casullo
Gunji Hiroshi
Tachibana Daikichi
Yamaguchi Kenichi
Beck Shrive
Cameron Erma
Hitachi Telecon Technologies Ltd.
Sanwa Laboratory Ltd.
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