Method for use in the manufacture of semiconductor devices and a

Wireworking – Wire straightening

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B21F 102

Patent

active

053017200

ABSTRACT:
Distortions of electrical leads projecting from an integrated circuit chip are corrected simultaneously instead of in sequence to prevent a corrected distortion from reappearing.
Semiconductor components are manufactured by means of electrically conductive plastic tools instead of steel tools thereby greatly reducing the cost of manufacture and handling.

REFERENCES:
patent: 4481984 (1984-11-01), Linker
patent: 5219404 (1993-06-01), Moore et al.

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