Method for use in brazing an interconnect pin to a metallization

Details Method for use in brazing an interconnect pin to a metallization Method for use in brazing an interconnect pin to a metallization

1985-04-11

1987-06-16

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29590, 29591, 29843, 428622, 357 65, H01L 2188

Patent

active

046727396

ABSTRACT:
A method for use in brazing an interconnect pin to a portion of metallization pattern (e.g. a pad) existing on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, is disclosed. A dielectric layer is formed with appropriate annular openings. Each opening provides a closed containment wall, which extends around and above the pad, to hold the brazing alloy. Each circular containment wall is concentrically aligned with its associated pad and exposes an area, of each pad, having a smaller diameter than that of the entire pad. The containment walls serve to prevent the brazing alloy from coming into contact with any edge of the pads.

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