Method for use in bonding a chip to a substrate

Details Method for use in bonding a chip to a substrate Method for use in bonding a chip to a substrate

1999-02-25

1999-10-26

Ryan, Patrick

Metal fusion bonding

Process

With clamping or holding

228 447, 29740, 29743, 269 21, B23K 522, B23K 3700, B23P 1900, B25B 1100

Patent

active

059712570

ABSTRACT:
A fixture for use in the bonding of a plurality of chips each to a respective one of a plurality of substrates includes a lower vacuum chuck and a frame member supported on the chuck for reciprocatory motion toward and away from the chuck surface. The chuck surface is arranged to hold substrates with predeposited solder in pockets at predetermined locations thereon. The frame member has openings aligned with those pockets and weights which extend through the openings. After substrates are placed on the chuck surface, the substrates are heated so that the predeposited solder reaches eutectic status, and then chips are placed on the substrates. The frame member is then mounted on the chuck and gradually lowered until the weights press against respective chips, thereby holding the chips in position on the substrates. The entire assembly is then transported to a solder reflow bonding station.

REFERENCES:
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patent: 4607779 (1986-08-01), Burns
patent: 4627151 (1986-12-01), Mulholland et al.
patent: 4664309 (1987-05-01), Allen et al.
patent: 4893403 (1990-01-01), Heflinger et al.
patent: 4907959 (1990-03-01), Hauch
patent: 5250781 (1993-10-01), Kanda et al.
patent: 5317803 (1994-06-01), Spigarelli et al.
patent: 5499443 (1996-03-01), Ota et al.
patent: 5641112 (1997-06-01), Moradi et al.

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