Method for uniform film coating of substrates

Details Method for uniform film coating of substrates Method for uniform film coating of substrates

1996-06-12

1997-12-09

Bareford, Katherine A.

Coating processes

Direct application of electrical, magnetic, wave, or...

Sonic or ultrasonic

4274343, 4274345, B06B 120

Patent

active

056958331

ABSTRACT:
Method and apparatus for applying thin films of coating material with a high degree of uniformity, high utilization of coating fluid and superior adhesion characteristics are disclosed. According to the method, an inverted substrate is moved horizontally and countercurrent to a two stage coating fluid applicator assembly. The first coating stage utilizes megasonic pressure waves directed inclinedly upwardly through the coating fluid/substrate surface interface to wet, clean, degas and deposit coating fluid on the substrate surface. A second stage removes excess coating fluid at the substrate's trailing edge so as to precisely establish a thin and uniform coating film. After the coating has been applied, spinning of the substrate may be employed to enable further coating film uniformity and to increase the film's drying rate.

REFERENCES:
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patent: 4246865 (1981-01-01), Shimada et al.
patent: 4307128 (1981-12-01), Nagano et al.
patent: 4370356 (1983-01-01), Bok et al.
patent: 4566624 (1986-01-01), Comerford
patent: 4666077 (1987-05-01), Rahn et al.
patent: 4696885 (1987-09-01), Vijan
patent: 4757781 (1988-07-01), Fukuda et al.
patent: 4848642 (1989-07-01), Kondo
patent: 5270079 (1993-12-01), Bok

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