Method for uniform cleaning of wafers using megasonic energy

Details Method for uniform cleaning of wafers using megasonic energy Method for uniform cleaning of wafers using megasonic energy

1994-07-18

1995-06-27

Langel, Wayne

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134902, B08B 312

Patent

active

054276225

ABSTRACT:
Apparatus and method for cleaning/etching the surface of an article with sonic energy in the megahertz range which employ an anti-reflection mechanism within a recirculation tank. A tank having at least one side wall and a bottom structure holds a cleaning/etching liquid and a megasonic transducer is associated with the tank for projecting megasonic energy into the liquid. The anti-reflection mechanism is disposed within the tank in close association with the at least one sidewall or bottom structure of the tank to thereby minimize reflection of megasonic energy from the associated surface. Preferably, the megasonic transducer is associated with a first tank sidewall which opposes a second tank sidewall, and the anti-reflection mechanism is disposed adjacent the second tank sidewall. By way of example, the anti-reflection mechanism can comprise a stream of gas bubbles, a plurality of anechoic structures, or a combination of both gas bubbles and anechoic structures.

REFERENCES:
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patent: 5037208 (1991-08-01), Dussault et al.
patent: 5038808 (1991-08-01), Hammond et al.
Syverson et al., "The Benefits of SC-1/SC-2 Megasonic Wafer Cleaning", Burlington Tech. Bulletin, pp. 1-8, Oct. 1991.
Gow et al., "A Method for Evaluating Cleaning Techniques for the Removal of Particulates from Semiconductor Surfaces", Burlington Technical Bulletin, pp. 1-7, Oct. 1991.

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