Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-07-06
1995-02-07
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29840, 427 96, H05K 330
Patent
active
053866240
ABSTRACT:
A method and apparatus for underencapsulating a component (502) on a substrate (402). The method robotically places an underencapsulant film (406) on at least one surface of a first surface of the component (502) and a second surface of a substrate (402), the first and second surfaces substantially opposing each other when the component (502) is placed on the substrate (402). Next, the method places the component (502) on the substrate (402) to dispose the underencapsulant film (406) between the first and second surfaces. The method then bonds (1006,1008 or 1006,1010) the component (502) to the substrate (402) with the underencapsulant (406).
REFERENCES:
patent: 3559279 (1971-02-01), Miklaszewski
patent: 3665590 (1972-05-01), Percival
patent: 4157932 (1979-06-01), Hirata
patent: 4416054 (1983-11-01), Thomas et al.
patent: 4644445 (1987-02-01), Sakuma
patent: 4779338 (1988-10-01), Kohara et al.
patent: 4887760 (1989-12-01), Yoshino et al.
patent: 4955132 (1990-09-01), Ozawa
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5022580 (1991-06-01), Pedder
patent: 5040717 (1991-08-01), McGaffigan
patent: 5085913 (1992-02-01), Wong
patent: 5106011 (1992-04-01), Yamazaki et al.
patent: 5210938 (1993-05-01), Hirai
patent: 5274913 (1994-01-01), Grebe et al.
Brooks Richard K.
George Reed A.
Mangold Richard L.
Arbes Carl J.
Lamb James A.
Motorola Inc.
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