Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2011-04-19
2011-04-19
Pham, Thanh V (Department: 2894)
Semiconductor device manufacturing: process
With measuring or testing
Reexamination Certificate
active
07927893
ABSTRACT:
A method for analyzing a sample for the manufacture of integrated circuits, e.g. MOS transistors, application specific integrated circuits, memory devices, microprocessors, system on a chip. The method includes providing an integrated circuit chip, which has a surface area with at least one region of interest, e.g., bond pad. The method includes covering a first portion of the surface area including the region of interest using a blocking material. The method also forms a metal layer on a second portion of the surface area, while the blocking material protects the first portion. The method removes the blocking material to expose the first portion of the surface area including the region of interest. The method also subjects the metal layer to a voltage differential to draw away one or more charged particles from the first portion of the surface area. The method also subjects the surface area including the region of interest to spectrometer analysis.
REFERENCES:
patent: 7504269 (2009-03-01), Zhang et al.
patent: 2002/0123161 (2002-09-01), Ushiki et al.
patent: 2003/0073278 (2003-04-01), Ohmi et al.
patent: 2004/0159944 (2004-08-01), Datta et al.
patent: 2005/0017355 (2005-01-01), Chou et al.
patent: 2005/0272244 (2005-12-01), Wada
Carlson, “Auger Electron Spectroscopy.”Photoelectron and Auger Spectroscopy, Ch. 6, Sections 4.1 and 4.4, pp. 314-317, 321-332. Plenum Press: New York, 1975.
Joshi et al., “Auger Electron Spectroscopy.”Methods of Surface Analysis, Czanderna, ed. Ch. 5, Section V, pp. 187-222. Elsevier Scientific Publishing Co: Amsterdam, The Netherlands, 1975.
Morabito et al., “The use of Auger electron spectroscopy and secondary ion mass spectrometry in the microelectronic technology.”Method of Surface Analysis, Czanderna, ed. Ch. 7, Section XIV(D), p. 323. Elsevier Scientific Publishing Co: Amsterdam, The Netherlands, 1975.
Notice of Allowance for U.S. Appl. No. 11/378,400, mailed on Nov. 4, 2008, 7 pages.
Final Office Action for U.S. Appl. No. 11/378,400, mailed on Apr. 29, 2008, 11 pages.
Non-Final Office Action for U.S. Appl. No. 11/378,400, mailed on Nov. 1, 2007, 9 pages.
Li Ming
Liao Scott
Niou Chorng Shyr
Zhang Qi Hau
Kilpatrick Townsend and Stockton LLP
Pham Thanh V
Semiconductor Manufacturing International (Shanghai) Corporation
Tran Tony
LandOfFree
Method for treatment of samples for auger electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for treatment of samples for auger electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for treatment of samples for auger electronic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2685112