Semiconductor device manufacturing: process – Gettering of substrate – By implanting or irradiating
Reexamination Certificate
2006-04-18
2006-04-18
Weiss, Howard (Department: 2814)
Semiconductor device manufacturing: process
Gettering of substrate
By implanting or irradiating
C438S004000, C438S974000
Reexamination Certificate
active
07029993
ABSTRACT:
The invention relates to a method for treating substrates (50) for microelectronics or optoelectronics, whereby said substrates comprise a useful layer (52) on at least one of the surfaces thereof. The inventive method includes a mechanical/chemical polishing step occurring on a bare surface (54) of the useful layer and is characterized in that it also comprises a post-curing step in a reductive atmosphere (100) before said polishing step occurs.
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Aga Hiroji
Auberton-Herve André
Barge Thierry
Tate Naoto
Pizarro Marcos D.
S.O.I.Tec Silicon on Insulator Technologies S.A.
Weiss Howard
Winston & Strawn LLP
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