Method for treating polyetherimide substrates and articles obtai

Stock material or miscellaneous articles – Composite – Of metal

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428 358, 427304, 427306, C23C 2600

Patent

active

049992511

ABSTRACT:
The method is provided for treating the surface of a polyetherimide substrate to improve its adhesion characteristics for electrolessly deposited metal, such as copper. There is employed a series of surface treatments including the initial immersion of the polyetherimide substrate in sulfuric acid, contact with aqueous base, such as potassium hydroxide, followed by oxidation with an alkali metal permanganate such as potassium permanganate, and surface treatment with a reducing agent, such as a hydroxylamine salt. Polyetherimide metal composites are also provided.

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