Liquid purification or separation – Processes – Making an insoluble substance or accreting suspended...
Patent
1997-03-28
1998-09-01
Hruskoci, Peter A.
Liquid purification or separation
Processes
Making an insoluble substance or accreting suspended...
210725, 210727, 210731, 210778, 210912, C02F 154
Patent
active
058007180
ABSTRACT:
A method of treating a spent dry film stripping and/or developing solution comprising the steps of adding about 0.01 to 15 grams of an aluminum source per liter of solution; adding about 0.05 to 25 grams of a metal precipitating agent per liter of solution; mixing the aluminum source, the metal precipitating agent and the solution with one another to form a mixture; adding an acid source to the mixture to lower the pH to less than about 6.5; and filtering the mixture to separate the metals and the photoresist from the remainder of the solution. The composition may also include 0 to 10 percent by weight of a dust-suppression agent, per liter of the solution, 0.1 to 10 grams of siliceous particulates per liter of spent stripper solution and/or an agent to enhance flocculation of the polymer precipitate.
REFERENCES:
patent: 4049545 (1977-09-01), Horvath
patent: 4559143 (1985-12-01), Asada et al.
patent: 4760014 (1988-07-01), Wong
patent: 4857206 (1989-08-01), Choo
patent: 4882070 (1989-11-01), Wardell
patent: 4999114 (1991-03-01), Choo
patent: 5106510 (1992-04-01), Rieber
patent: 5182029 (1993-01-01), Erb
patent: 5200086 (1993-04-01), Shah et al.
patent: 5308502 (1994-05-01), Brown
patent: 5615862 (1997-04-01), Gaudette
Gaudette Robert M.
Hruskoci Peter A.
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