Method for treating copper and for using the thus-treated copper

Details Method for treating copper and for using the thus-treated copper Method for treating copper and for using the thus-treated copper

1985-03-26

1986-05-27

Stallard, Wayland

Metal treatment

Compositions

Heat treating

148 115C, B23P 320

Patent

active

045913943

ABSTRACT:
There is described a method for treating copper which will be used to manufacture a bimetal plate to be deep-drawn or formed, from a copper layer and a chromium-nickel steel layer, which comprises adding to a liquid copper bath, a grain growth-inhibiting component, which is preferably comprised of boron, zirconium and/or titanium.

REFERENCES:
patent: 2161468 (1939-06-01), Hensel et al.
patent: 2718690 (1955-09-01), Ulam
patent: 3381364 (1968-05-01), Winter
patent: 3836360 (1974-09-01), Bray
patent: 4088475 (1978-05-01), Tyler et al.
patent: 4284436 (1981-08-01), Stefan et al.

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