Method for treating an oxidized copper film

Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate

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216106, 252 794, 428209, B44C 122, C23F 100

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active

054925959

ABSTRACT:
The present invention is directed to an improved method for treating an oxidized surface of a copper film for bonding to a resinous layer such as in the formation of a single-sided, double-sided, or multi-layered circuit board and to a layered product produced by the method. In particular, the method of the present invention comprises the steps of: contacting the oxidized surface of a copper film, having cupric oxide whiskers protruding therefrom, with an acidic reducing solution having a pH of 1 to 6.5 and having an effective amount of a water soluble thiosulfate reducing agent dissolved therein to provide a reduced copper surface; and rinsing the reduced copper surface with an acidic solution to produce a rinsed and reduced copper surface having reduced whiskers protruding therefrom, said reduced whiskers each being a mix of cuprous oxide and metallic copper. Preferably, the reduced surface is treated with a passivating agent to minimize any reoxidation prior to laminate formation.

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Danehy et al., "Iodometric Method For The Determination Of Dithionite, Bisulfite, And Thiosulfate In The Presence Of Each Other And Its Use In Following The Decomposition Of Aqueous Solutions Of Sodium Dithionite," Analytical Chem., 46 pp. 391-394 (1974).

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