Package making – Methods – Filling preformed receptacle and closing
Patent
1994-07-28
1996-04-02
Coan, James F.
Package making
Methods
Filling preformed receptacle and closing
53254, 53473, B65B 2300
Patent
active
055029531
ABSTRACT:
A wafer transporting/storing method includes steps of accommodating one wafer in each flat casing, and transporting/storing the casing. A wafer carrier includes a flat casing, one side surface of which is opened as a wafer entrance/exit, a cover for closing the wafer entrance/exit, and a cover urging device, disposed between the casing and the cover, for urging the cover in a closed direction. The flat casing has a space for accommodating one wafer. In the carrier, at both sides of intermediate portions of the upper and lower surfaces of the space are inclined in the directions from each intermediate portion toward both ends of each of the upper and lower surfaces so that an interval between the upper and lower surfaces of the space becomes narrower toward both ends of the space.
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Mori Kazuhiro
Nakayama Ichiro
Tanno Masuo
Coan James F.
Matsushita Electric - Industrial Co., Ltd.
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