Method for transmitting current through a substrate

Details Method for transmitting current through a substrate Method for transmitting current through a substrate

2006-12-26

2006-12-26

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S846000, C029S847000, C029S852000, C174S255000, C174S262000, C361S794000

Reexamination Certificate

active

07152312

ABSTRACT:
A method for transmitting high-frequency current through a substrate is provided. The method comprises receiving the high-frequency current at a via passing through at least one conductive plane disposed within the substrate and coupled to the via with one or more tabs which span a gap between the at least one conductive plane and the via; and directing the high-frequency current along an uninterrupted path substantially on a surface of the via thereby bypassing the at least one conductive plane by conducting at least a portion of the high-frequency current between the one or more tabs.

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