Method for transferring wafers from one processing station to an

Details Method for transferring wafers from one processing station to an Method for transferring wafers from one processing station to an

1994-09-29

1995-07-04

Picardat, Kevin M.

Metal working

Barrier layer or semiconductor device making

414935, 414936, 414939, 414941, B65G 4907

Patent

active

054296420

ABSTRACT:
A method for transferring wafers from one processing station to another station sequentially, utilizing a transfer system which is installed in a clean bench forming a downward flow of clean air. A plurality of stations is provided for processing wafers in the clean bench. The transfer system comprises at least a single transfer robot carrying a plurality of wafers, the transfer robot being movable from one station to another sequentially for processing, and an exhaust duct is provided along a path of the transfer robot movement, the duct having a plurality of inlets for exhausting the air. The method of the invention comprises (a) providing partition walls for each of the transfer robots, the walls surrounding the plurality of wafers and defining an air flow chamber and an air filter arranged on the top of the chamber, thereby forming a downward air flow in the surrounding chamber, and (b) controlling a total amount of clean air supplied to the transfer system so as to be less than an air supply amount to the clean bench.

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