Method for transferring wafers

Details Method for transferring wafers Method for transferring wafers

2005-06-02

2010-10-05

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S017000, C438S020000, C438S455000, C438S458000, C438S463000, C257SE21122, C257SE21238, C257SE21505, C257SE21599, C257SE21705

Reexamination Certificate

active

07807482

ABSTRACT:
The invention concerns a method for preparing a thin layer (28) or a chip to be transferred onto another substrate, this method including the realization, above the surface of said thin layer or said chip, of at least one layer, called adhesive layer (25), and of at least one layer, called first barrier layer (22), the adhesive layer being made of a material of which etching presents selectivity in relation to the material of the barrier layer.

REFERENCES:
patent: 5534328 (1996-07-01), Ashmead et al.
patent: 5641416 (1997-06-01), Chadha
patent: 5656552 (1997-08-01), Hudak et al.
patent: 5780354 (1998-07-01), Dekker et al.
patent: 5804086 (1998-09-01), Bruel
patent: 5948255 (1999-09-01), Keller et al.
patent: 6013534 (2000-01-01), Mountain
patent: 6027958 (2000-02-01), Vu et al.
patent: 6214733 (2001-04-01), Sickmiller
patent: 6593229 (2003-07-01), Yamamoto et al.
patent: 6607970 (2003-08-01), Wakabayashi
patent: 6653206 (2003-11-01), Yanagita et al.
patent: 6846698 (2005-01-01), O'Keefe et al.
patent: 6902987 (2005-06-01), Tong et al.
patent: 7041178 (2006-05-01), Tong et al.
patent: 7387944 (2008-06-01), Tong et al.
patent: 7713369 (2010-05-01), Asper et al.
patent: 2002/0022343 (2002-02-01), Nonaka
patent: 2002/0115263 (2002-08-01), Worth et al.
patent: 2003/0032294 (2003-02-01), Gardes
patent: 2003/0064579 (2003-04-01), Miyakawa et al.
patent: 2004/0222500 (2004-11-01), Aspar et al.
patent: 2005/0029224 (2005-02-01), Asper et al.
patent: 2007/0072393 (2007-03-01), Aspar et al.
patent: 2008/0128868 (2008-06-01), Aspar
patent: 2008/0254596 (2008-10-01), Aspar et al.
patent: 1251557 (2002-10-01), None
patent: 2828579 (2003-02-01), None
patent: 334610 (1996-12-01), None
patent: 08334610 (1996-12-01), None
French Preliminary Search Report, PCT/FR2005/050411, 7 pgs., (Nov. 15, 2005).
French Preliminary Search Report, FR 0451085; FA 650392, 4 pgs., (Dec. 17, 2004).

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