Method for thinning wafers that have contact bumps

Details Method for thinning wafers that have contact bumps Method for thinning wafers that have contact bumps

2006-11-14

2006-11-14

Goudreau, George A. (Department: 1763)

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

C216S089000, C438S692000, C438S693000, C451S057000

Reexamination Certificate

active

07135124

ABSTRACT:
In accordance with the foregoing objects and advantages, the present invention provides a fabrication device that may be used during the grinding operation of the fabrication process. The fabrication device comprises a socket plate that includes a plurality of cavities formed therein that correspond in position and number to the solder (or other conductive material) bumps formed on the front surface of a product wafer.

REFERENCES:
patent: 6120360 (2000-09-01), Ball et al.
patent: 6416616 (2002-07-01), Walker
patent: 6638389 (2003-10-01), Kassir et al.
patent: 6702652 (2004-03-01), Arai
patent: 01-222450 (1989-09-01), None
patent: 02-239621 (1990-09-01), None
patent: 2002-319558 (2002-10-01), None

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