Method for thinning substrate and method for manufacturing...

Details Method for thinning substrate and method for manufacturing... Method for thinning substrate and method for manufacturing...

2011-04-05

2011-04-05

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S458000, C438S464000, C438S691000, C438S692000

Reexamination Certificate

active

07919394

ABSTRACT:
A method for thinning a substrate and a method for manufacturing a circuit device which make it possible to prevent the pattern of penetrating holes of a supporting plate from being transferred to the surface of the substrate and prevent non-uniform grinding of the surface of the substrate from occurring. The supporting plate and the substrate are joined by using an adhesive layer, and a sheet is attached to the supporting plate. The surface of the supporting plate to which the sheet has been attached is mounted and fixed by attraction onto an attracting head. The surface of the semiconductor wafer on which no circuit device is formed is ground by a grinder in this state.

REFERENCES:
patent: 6492195 (2002-12-01), Nakanishi et al.
patent: 6943056 (2005-09-01), Nemoto
patent: 7052934 (2006-05-01), Kurimoto et al.
patent: 7211168 (2007-05-01), Miyanari
patent: 2002/0036077 (2002-03-01), Getchel et al.
patent: 2005-150434 (2005-06-01), None

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