Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-01-26
1995-12-19
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156154, 156230, 156241, 1562755, 1562757, 1562722, 156344, B32B 3104, B32B 3122, B32B 3128
Patent
active
054765668
ABSTRACT:
Advances in wafer technology and packaging have led to an increase in wafer size while requiring a decrease in wafer thickness. Thickness limitations increase as wafer diameter increases. Thinning a wafer past a certain limit can result in wafer breakage. A laminated semiconductor wafer structure (10) is assembled to provide mechanical support for the wafer. A semiconductor wafer (12) is affixed to a UV transparent support substrate (16) with a double-sided adhesive tape (14). The tape has dissimilar adhesives on its two sides. The first side has a UV curable adhesive (22) that adheres to the active surface of the wafer. The second side has a non-UV curable adhesive (24) which adheres to the UV transparent support substrate. This laminated structure can be used during a wafer thinning process and any subsequent handling. The support substrate and the tape are removed from the wafer by exposing the laminated structure to UV radiation.
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Clark Minh-Hien N.
Mayes M. Curtis
Motorola Inc.
Simmons David A.
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