Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-12-12
1999-12-07
Young, Lee
Metal working
Method of mechanical manufacture
Electrical device making
29832, 29740, 22818022, 228223, H05K 332
Patent
active
059962216
ABSTRACT:
A method for thermocompression bonding structures together including structures having different coefficients of thermal expansion, for example, thermocompression bonding optical diode arrays or other semiconductor structures to silicon substrates to form electronic or optoelectronic devices. The method includes aligning and contacting the structures to be interconnected, thermocompressing the structures via their contact pad elements at a bonding temperature, establishing an encapsulation temperature, applying an encapsulant material between the bonded structures, and curing the encapsulant material at the encapsulation temperature. Conventional bonding processes, which treat encapsulation as a separate step apart from bonding processes, melt the bonded assembly together and include at least one thermal cycle in which the bonded assembly is cooled to room temperature and then is re-heated to the encapsulation temperature before applying the encapsulant material. The inventive method eliminates this thermal cycle by including encapsulation as an integral step in the thermocompression bonding process and therefore reduces or eliminates the possibility of damage to bonds or their multi-layered contact elements between the time of bonding and the time of encapsulation. Resultingly, the inventive method advantageously improves the quality and reliability of the resulting bonds within the formed device compared to bonds formed in a conventional manner.
REFERENCES:
patent: 5207864 (1993-05-01), Bhat et al.
patent: 5386624 (1995-02-01), George et al.
patent: 5406025 (1995-04-01), Carlstedt
patent: 5483421 (1996-01-01), Gedney et al.
patent: 5638597 (1997-06-01), Cutting et al.
patent: 5739053 (1998-04-01), Kawakita et al.
patent: 5785234 (1998-07-01), Weiss et al.
patent: 5813115 (1998-09-01), Misawa et al.
patent: 5816478 (1998-10-01), Kaskoun et al.
patent: 5873161 (1999-02-01), Chen et al.
Chirovsky Leo Maria Freishyn
Cunningham John Edward
D'Asaro Lucian Arthur
Goossen Keith Wayne
Chang Rick Kiltae
Harman John M.
Lucent Technologies - Inc.
Young Lee
LandOfFree
Method for thermocompression bonding structures does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for thermocompression bonding structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for thermocompression bonding structures will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-810203