Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-07-19
2005-07-19
Fuqua, Shawntina (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S405000, C219S411000, C219S448190, C219S494000, C219S458100, C219S477000, C392S416000, C392S418000, C118S724000, C118S725000, C118S728000, C118S050100
Reexamination Certificate
active
06919538
ABSTRACT:
To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.
REFERENCES:
patent: 5650082 (1997-07-01), Anderson
patent: 5740016 (1998-04-01), Dhindsa
patent: 5790750 (1998-08-01), Anderson
patent: 6184498 (2001-02-01), Kiyama
patent: 19907497 (2000-08-01), None
patent: WO99/23690 (1999-05-01), None
patent: WO00/01628 (2000-01-01), None
patent: WO00/51170 (2000-08-01), None
Dietze Uwe
Dress Peter
Saule Werner
Szekeresch Jakob
Becker Robert W
Fuqua Shawntina
Robert W Becker & Associates
Steag HamaTech AG
LandOfFree
Method for thermally treating substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for thermally treating substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for thermally treating substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3381210